LAMINATED HEAT DISSIPATING BASE BODY, AND HEAT DISSIPATING UNIT AND ELECTRONIC DEVICE USING THE LAMINATED HEAT DISSIPATING BASE BODY

摘要

A laminated heat dissipating base body (1) is provided with insulating first substrate (21) and second substrate (22) vertically arranged to face each other; a heat dissipating member (42) sandwiched between the first substrate (21) and the second substrate (22); and circuit members (41) arranged on the upper surface of the first substrate (21) on the upper side, and on the lower surface of the second substrate (22) on the lower side. A bonding member is arranged at least between the first substrate (21) and the heat dissipating member (42) or between the second substrate (22) and the circuit member (41). The bonding member has active metal layers (31, 32) including an active metal, on the side of the first substrate (21) and/or the second substrate (22), and bonding layers (51, 52) composed of metal on at least one side of the heat dissipating member (42) and the circuit member (41).