SUBSTRATE TRANSPORTING UNIT

摘要

A substrate transfer device is equipped with the carrier fork where the bend is difficult to be generated even though the substrate is exposed under the high temperature. A substrate transfer device performs carry in and out of the substrate to/from the plasticizing substrate furnace. The substrate transfer device comprises the carrier fork(24), and the driving part. The carrier fork supports the substrate to the side support state. The driving part moves the carrier fork to the plasticizing substrate furnace. The carrier fork comprises the body member(B) and the ceiling plate member(H). The body member is the honeycomb structure body. The ceiling plate member is formed with the material in which the coefficient of thermal expansion is smaller than the sieving member welded into the upper side of the body member.