发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A photoresist resin composition, a method for patterning a photoresist by using the composition, an LCD device containing the photoresist pattern, a method for patterning a microcircuit by using the composition are provided to reduce the pattern transfer inferiority remarkably in etching process and to improve aging storage stability. A photoresist resin composition comprises 3-30 wt% of an alkali-soluble resin; 1-10 wt% of a sensitizer; 0.01-1 wt% of an adhesion enhancer represented by the formulas 1 and 2; and 59-95.99 wt% of an organic solvent, wherein X is a direct bond, a C1-C6 alkylene group, -R3OR4- or -R3NHR4-; R3 and R4 and independently a C1-C6 alkylene group; R1 and R2 are a C1-C6 alkyl group; n and m are an integer of 0-4; X' is a direct bond, a C1-C6 alkylene group, -R'3OR'4- or -R'3NHR'4-; R'3 and R'4 and independently a C1-C6 alkylene group; and R'1 and R'2 are a C1-C6 alkyl group.</p>
申请公布号 KR20080107846(A) 申请公布日期 2008.12.11
申请号 KR20070056151 申请日期 2007.06.08
申请人 LG CHEM. LTD. 发明人 PARK, CHAN HYO;KIM, KYUNG JUN;SEO, SUNG WOO;PARK, KWANG HAN;CHOI, BO YUN;SHIN, HYE IN;SON, YONG KOO
分类号 G03F7/004 主分类号 G03F7/004
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