| 摘要 |
PROBLEM TO BE SOLVED: To easily peel a wafer from a support plate which are bonded to each other using an adhesive. SOLUTION: The peeling device 10 peels a pasted product 18 obtained by pasting a support plate 14 to a wafer 12 using an adhesive into the support plate 14 and the wafer 12. The peeling device 10 is provided with a plasma treatment section 60 for applying O<SB>2</SB>plasma treatment to the pasted product 18, and a peeling section 70 for peeling the pasted product 18 treated in the plasma treatment section 60 into the support plate 14 and the wafer 12. COPYRIGHT: (C)2009,JPO&INPIT |
