发明名称 CURABLE RESIN COMPOSITION AND CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition which can be cured by ultraviolet rays, has long-term reliability of electrical insulation of its cured product, can be utilized in a film-forming material (an overcoating agent) and the like due to its flexibility and small warpage by cure shrinkage, and particularly can be used in the formation of a protective film for low tack, flexible wiring circuits. SOLUTION: The curable resin composition comprises a curable resin obtained by reacting (A) a carboxy group-containing urethane resin using (a) a polyisocyanate compound, (b) a polyol compound, and (c) a dihydroxy compound having a carboxy group as raw materials with (B) a compound having both a (meth)acrylic double bond and an epoxy group, and a cured product is obtained therefrom. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008297440(A) 申请公布日期 2008.12.11
申请号 JP20070145171 申请日期 2007.05.31
申请人 SHOWA DENKO KK 发明人 SAKATA YUKO;UCHIDA HIROSHI
分类号 C08F299/06;C08G18/67 主分类号 C08F299/06
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