| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor device having a plurality of built-in semiconductor elements stacked. <P>SOLUTION: The semiconductor device 10A is provided with a first semiconductor element 12 fixed on a first island 16 and a second semiconductor element 14 fixed on a second island 18, wherein the first island 16, the first semiconductor element 12, the second island 18 and the second semiconductor element 14 are disposed so as to be superimposed. Further, the first semiconductor element 12 is disposed on the upper surface of the first island 16 and the second semiconductor element 14 is disposed on the lower surface of the second island 18. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
