发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER |
摘要 |
An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
|
申请公布号 |
US2008303123(A1) |
申请公布日期 |
2008.12.11 |
申请号 |
US20080134179 |
申请日期 |
2008.06.05 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN HUI;PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D |
发明人 |
CAMACHO ZIGMUND RAMIREZ;TAY LIONEL CHIEN HUI;PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|