发明名称 |
METHOD AND APPARATUS FOR DEBONDING OF STRUCTURES WHICH ARE BONDED TOGETHER, INCLUDING (BUT NOT LIMITED TO) DEBONDING OF SEMICONDUCTOR WAFERS FROM CARRIERS WHEN THE BONDING IS EFFECTED BY DOUBLE-SIDED ADHESIVE TAPE |
摘要 |
When heat or UV radiation is applied to an adhesive tape (130) which bonds a semiconductor wafer (110) to a carrier (120), the appropriate lift-off time for separating the wafer from the carrier is determined by monitoring the thickness (T or DeltaT) of the wafer/tape/carrier sandwich. When the thickness or the thickness change has reached a predefined value or range of values, independently moveable driving members (510R) drive the wafer or the carrier with small forces at a plurality of spaced-apart locations along the periphery. As a result, the lift-off is initiated at the location of the weakest adhesion.
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申请公布号 |
US2008302481(A1) |
申请公布日期 |
2008.12.11 |
申请号 |
US20070759682 |
申请日期 |
2007.06.07 |
申请人 |
TRU-SI TECHNOLOGIES, INC. |
发明人 |
BERGER ALEXANDER J.;BERGER MICHAEL A. |
分类号 |
B32B38/10 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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