| 摘要 |
A semiconductor device is provided to enhance the reliability of the device by using the high intensity fibroid materials in order to block the distribution of pressure applied to the semiconductor device. A semiconductor device comprises the device layer(103), and a pair of structures(101,102). The device layer comprises the semiconductor device. Each structure comprises the laminate of a plurality of fibroid materials(101a through 101c, 102a through 102c) in which the organic resin is dipped. The device layer adheres between a pair of structures. The fibroid materials are selected from the group of the polyvinyl alcohol fiber, the polyester fiber, the polyamide fiber, the polyethylene fiber, the aramid-based fiber, the glass fiber and the carbon fiber. |
