HYDROXYAMIDE GROUP-CONTAINING ALICYCLIC POLYIMIDE, PRECURSOR OF THE SAME, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION BY USING THEM AND THEIR CURED MATERIALS

摘要

PROBLEM TO BE SOLVED: To provide a polybenzoxazole imide film useful as a protecting film of a semiconductor element and plastic substrate plate for a display by using a hydroxyamide group-containing alicyclic polyimide having a high transmission at an i-line (365 nm), or its precursor.

SOLUTION: This polybenzoxazole imide film is formed by performing pattern exposure and alkali development of the film of a positive type photosensitive resin composition containing a diazonaphthoquinone-based photosensitizer in the hydroxyamide group-containing alicyclic polyimide containing a recurring unit expressed by general formula (4) [wherein, A is a tetravalent aromatic group; and B is a divalent aromatic or aliphatic group] or its precursor, and then heating.

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