发明名称 METHOD OF MANUFACTURING SUBSTRATE WITH PENETRATING ELECTRODES
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with penetrating electrodes adapted to enable preventing breakages of the penetrating electrodes, reducing production cost of the substrate with penetrating electrodes and also preventing creation of voids in the penetrating electrodes. SOLUTION: The present invention provides a method of manufacturing a substrate 10 with penetrating electrodes which has a substrate 11 provided with through-holes 18 and penetrating electrodes 14 received in the through-holes 18. The method includes a penetrating electrode forming step of forming the penetrating electrodes 14 on a supporting plate, a substrate forming step of forming the substrate 11, a penetrating electrode receiving step of superposing the substrate 11 on the supporting plate and receiving the penetrating electrodes 14 in the through-holes 18, a resin filling step of filling a resin 12 in interspaces between inner walls of the through-holes 18 of the substrate 11 and sidewalls of the penetrating electrodes 14, and a supporting-plate elimination step of eliminating the supporting plate after finishing the resin filling step. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300782(A) 申请公布日期 2008.12.11
申请号 JP20070148182 申请日期 2007.06.04
申请人 SHINKO ELECTRIC IND CO LTD 发明人 YAMANO KOJI
分类号 H01L23/12;H01L23/15 主分类号 H01L23/12
代理机构 代理人
主权项
地址
您可能感兴趣的专利