METHOD OF PRODUCING A WAFER SCALE PACKAGE

摘要

The invention concerns a method for manufacturing a wafer scale package comprising at least one substrate having replicated optical elements. The method uses a two substrates, at least one of which is pre-shaped and has at least one recess in its front surface. Optical elements are replicated on a first substrate by causing a replication tool to abut at the first substrate. The second substrate is then attached to the first substrate in abutting relationship in such a way that the optical element is contained in a cavity formed by the recess in one of the substrates in combination with the other substrate. Thereby, a well defined axial distance between the optical elements and the second substrate is achieved. Consequently, also a well defined axial distance between the optical elements and any other objects attached to the second substrate, e.g. further optical elements, image capturing devices, light sources, is established.