MICROELECTROMECHANICAL SYSTEM PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME

摘要

A method for manufacturing a microelectromechanical system package is provided. A plurality of cavities is first formed on a surface of a silicon wafer. The surface of the silicon wafer is then bonded to the microelectromechanical system wafer in such a manner that the active areas of the chips on the microelectromechanical system wafer are corresponding to the cavities on the silicon wafer. The structure assembly of the two wafers is finally singulated to form individual microelectromechanical system chips whose active areas are covered by the cavities. In this way, the profile of the microelectromechanical system package may be reduced accordingly.