发明名称 SCRIBING APPARATUS USING ULTRASONIC WAVE
摘要 <p>An ultrasonic wave scribing apparatus is provided to cut minutely and cleanly cut materials by generating a vertical crack at the cut material by a perpendicular vibration of a scribing wheel and preventing influence of a horizontal vibration. An ultrasonic wave scribing apparatus contains a stage(110) in which a cut material is positioned, a support unit(120) which is installed on the stage, a cutting part(100) which is installed at a support unit and scribes the cut material and a vibration absorbing part installed between the support unit and the cutting part. The vibration absorbing part comprises buffer member which is one of natural rubber, synthetic rubber, silicon resin, urethane resin and poly vinyl alcohol.</p>
申请公布号 KR20080107754(A) 申请公布日期 2008.12.11
申请号 KR20070055954 申请日期 2007.06.08
申请人 HYO KWANG CO., LTD. 发明人 HWANG, WOON KI
分类号 C03B33/00;C03B33/02;C03B33/023 主分类号 C03B33/00
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