| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-melting solder glass which is workable at a soldering temperature of ≤600°C, has a thermal expansion coefficient of 6×10<SP>-6</SP>-11×10<SP>-6</SP>/K, can be melted with ease, and does not crystallize in a soldering process. SOLUTION: The lead-free glass frit contains, in wt.% on an oxide bases, 1 to <2, SiO<SB>2</SB>; 5-10, B<SB>2</SB>O<SB>3</SB>; 4.5-12, ZnO; 79-88, Bi<SB>2</SB>O<SB>3</SB>; and 0.6-2, Al<SB>2</SB>O<SB>3</SB>, and has a weight ratio of SiO<SB>2</SB>to Al<SB>2</SB>O<SB>3</SB>of <2, a linear thermal expansion coefficient α<SB>(20-300)</SB>of <11.5×10<SP>-6</SP>K<SP>-1</SP>and a transition temperature Tg of <380°C. COPYRIGHT: (C)2009,JPO&INPIT
|
