发明名称 Cooling apparatus and substrate treating apparatus
摘要 The object of the present invention is to provide a cooling apparatus which makes it possible to cool a substrate uniformly in a short period of time even if the substrate has a large area. The cooling apparatus 3 comprises a flat-box-shaped body 10, a cooling medium supply tube 11 which is inserted into the body 10, a nozzle 12 which is attached to the cooling medium supply tube 11 so as to eject the cooling medium toward the internal surface of the body, a pipe 13 for withdrawing water (refrigerant) ejected from the nozzle 12 toward the body 10, a chiller 14 for cooling the water from the pipe 13 to a predetermined temperature, and a circulating pipe 15 for sending the water which has been cooled by the chiller 14 back to the cooling medium supply tube 11.
申请公布号 US2008304027(A1) 申请公布日期 2008.12.11
申请号 US20080156896 申请日期 2008.06.05
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SHIMAI FUTOSHI;KAWATA SHIGERU
分类号 G03B27/52 主分类号 G03B27/52
代理机构 代理人
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