发明名称 SPUTTERING APPARATUS FOR FORMING THIN FILM
摘要 <p>A box-rotation multi-dimensional opposed sputtering apparatus in which the leakage magnetic fluxes outside the target holders is reduced, the pattern of the lines of magnetic flux between opposed targets can be easily varied, and the pattern of the lines of magnetic flux can be selected from various types of the patterns. The sputtering apparatus for forming a thin film has a pair of polygonal prism target holders holding targets arranged on the surfaces parallel to the rotation axes of rotatable polygonal prisms. The sputtering apparatus is characterized in that magnetic pole groups each composed of magnets or magnets and yokes are arranged on the back of each target, and that the magnetic pole groups include magnets whose magnetic polarity are different or yokes. At least a part of the yokes may be movable. Magnetic pole pieces for enhancing the uniformity of the magnetic flux density may be interposed between the back of each target and the magnets, and a back yoke may be provided on the opposite side of each magnetic pole group to the target.</p>
申请公布号 WO2008149635(A1) 申请公布日期 2008.12.11
申请号 WO2008JP58621 申请日期 2008.05.09
申请人 YAMAGUCHI UNIVERSITY;MOROHASHI, SHINICHI 发明人 MOROHASHI, SHINICHI
分类号 C23C14/34;H01L21/285 主分类号 C23C14/34
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