| 摘要 |
The ingot mounting method is provided to shorten effectively the hardening time of the epoxy adhesive by heat-hardening the ingot holder and the ingot. The ingot mounting method comprises as follows. A step is for providing ingot. The first preliminary step(S11) is for binding the slicing beam in which the first adhesive member is coated onto ingot. The second preliminary step(S13) is for binding the work plate in which the second adhesive member is coated onto the slicing beam. The thermal curing step(S15) is for heat-hardening the second preliminary body. The thermal curing step comprises the heat-up step and the cooling step. The heat-up step heats gradually the second preliminary body in the temperature range of a step type. The cooling step cools gradually the second preliminary body in the temperature range of a step type.
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