| 摘要 |
A flip chip package is provided to maintain the exact alignment of the bump and the conductive pad by the attractive force. A flip chip package comprises the flip chip(10), and the substrate(20). The flip chip comprises the metal wiring and the bump electrically connected to the metal wiring. The substrate is electrically connected to the terminal. The substrate has bumps(11,12) which correspond to the flip chip and conductive pads(21,22) which are bonded to the flip chip. At least two bump and the pads of the substrate have the opposite polarity, so that the attractive force is exist between the bump and the pad.
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