| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability by suppressing a wire length to become long, while maintaining production efficiency. <P>SOLUTION: The wire bonding portion of a lead frame 15 is constituted by a relay frame 5, by thinning the relay frame 5 than the other lead frame portions, the lead width and the lead pitch can be made small, since the lead frame 15 can be extended to the vicinity of a die pad 11, it is possible to suppress the wire length to become long, while maintaining production efficiency, and to improve the reliability. <P>COPYRIGHT: (C)2009,JPO&INPIT |
