| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface part mounting method and a board that obviates complex operating processings, by mounting a surface part on the basis of the position of solder of a mark for recognizing solder printed, in parallel with solder printing on a part land. <P>SOLUTION: In the surface part mounting method, a board recognition mark for recognizing the image of the board position is formed in parallel to the formation of a part land on the board, and a solder for recognition for recognizing the image of the solder printed position is printed, in parallel with the printing of solder on the part land; and when a surface part is mounted, the printed position of the solder for recognition is recognized through image recognition and the surface part is mounted on the position, based on the printed position of solder for recognition that is recognized and the mounting position data. <P>COPYRIGHT: (C)2009,JPO&INPIT |
