发明名称 CLEANING DEVICE, GRINDER AND HOLDING METHOD OF WAFER
摘要 PROBLEM TO BE SOLVED: To carry out a wafer easily even if the wafer is held for a long time on a spinner table of a cleaning device. SOLUTION: In the cleaning device 25 comprising at least a turnable spinner table 250 having a surface 250d for suction holding a wafer, a suction source 252 for transmitting a suction force to the holding surface 250d, and a nozzle 251 for supplying cleaning water to a wafer held on the spinner table 250, pores communicating with the suction source 252 are formed in the holding surface 250d, and the suction source 252 has a switching portion for selecting a first suction force acting during the rotation of the spinner table 250 and a second suction force acting during the stop of the spinner table 250. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300668(A) 申请公布日期 2008.12.11
申请号 JP20070145739 申请日期 2007.05.31
申请人 DISCO ABRASIVE SYST LTD 发明人 KIZAKI SEIKI;YAMANAKA SATOSHI
分类号 H01L21/683;B24B7/22;H01L21/304 主分类号 H01L21/683
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