| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device using an adhesive film for semiconductor having a superior mechanical strength, which can adhere to a wafer at a low temperature and which can bond a semiconductor element to a support member for mounting the semiconductor element, such as a lead frame, at a low temperature. SOLUTION: A resin varnish of 40% solid resin content is obtained by dissolving 100 pts.wt. of acrylic acid copolymer, 50 pts.wt. of crystalline cresol novolac-epoxy resin, 3 pts.wt. of an imidazole compound, 1 pts.wt. of (γ-glycidoxypropyl)trimethoxysilane and 30 pts.wt. of colloidal silica having an average particle diameter of 15 nm in methyl ethyl ketone. After applying the resin varnish using a komma coater to a polyethylene terephthalate film that is a carrier film, the 25μm thick semiconductor bonding film with the carrier film is obtained by drying at 70°C for 10 minutes. COPYRIGHT: (C)2009,JPO&INPIT
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