| 摘要 |
PROBLEM TO BE SOLVED: To practically and rationally remove resist whose surface has deteriorated from a substrate by a resist removing method and a device that use no chemicals to less affect environments. SOLUTION: The resist removing device 10 which removes resist 2 comprising a deteriorated layer 2a and an undeteriorated layer 2b from a substrate 1 performs a stage wherein resist removal is carried out by bringing radicals, produced by plasma-processing nitrogen, oxygen, hydrogen, steam, or mixed gas thereof under reduced pressure, into contact with the substrate 1, and a stage wherein resist removal is carried out by bringing ozone water into contact with the substrate 1. In the resist removal stage using the radicals, the majority of the undeteriorated layer 2b is left by controlling the contact time of the radicals according to formation conditions of the deteriorated layer 2a on the resist surface. Alternatively, the majority of the undeteriorated layer 2b is left by performing process control according to an analysis result of reaction gas discharged during the resist removal. COPYRIGHT: (C)2009,JPO&INPIT
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