| 摘要 |
A contact pad in an integrated circuit is disclosed. The contact pad comprises a flat portion comprising a base (302) of the contact pad; a plurality of projections (304, 306, 308, 310, 312) extending from and substantially perpendicular to the flat portion; and a solder ball (108, 124) attached to the projections and the flat portion. A method of forming a contact pad is also disclosed. |
