| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder bump forming apparatus capable of almost uniformizing the size of Benard cells generated by heating, also uniformly settling out solder particulates, uniformly forming a solder bump and obtaining a substrate with less dispersions of performances. <P>SOLUTION: The solder bump forming apparatus 1 includes the substrate 12 provided with a pad electrode, a container 10 for housing a solder composition containing solder particulates 13 to be supplied to the substrate 12, and a heating means 30 for heating the container 10, melting the solder composition 14 and sticking the solder particulates 13 onto the pad electrode. The container 10 is formed in a shape provided with a bottom surface part 10A which is a smooth surface for mounting the substrate, and a peripheral wall part 10B which is erected on the outer periphery and whose inner peripheral surface has a shape without recesses or projections. Also, a heat insulating member 20 for the peripheral wall is mounted on the peripheral wall part 10B, and a metal gauze 26 is provided on a position above the substrate 12, which is also the position to be in contact with the liquid surface of the solder composition 14 housed inside the container 10. <P>COPYRIGHT: (C)2009,JPO&INPIT |
