发明名称 |
SUBSTRATE FOR LIGHT-EMITTING ELEMENT PACKAGE, AND LIGHT-EMITTING ELEMENT PACKAGE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive and small-sized substrate for a light-emitting element package capable of satisfactorily heat-radiating from the light-emitting element as a substrate for packaging the light-emitting element, and to provide a light-emitting element package using the same. <P>SOLUTION: The substrate for the light-emitting element package includes: an insulating layer 1 composed of a resin 1a including thermally-conductive fillers 1b, 1c; a metal thick part 2 formed under a mounting position of the light-emitting element 4; and a surface electrode part 3 formed on the mounting side surface of the insulating layer 1 differently from the metal thick part 2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008300542(A) |
申请公布日期 |
2008.12.11 |
申请号 |
JP20070143714 |
申请日期 |
2007.05.30 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
SUZUKI MOTOHIRO;YONEMURA NAOKI;MAEDA TETSUO;YOSHIMURA EIJI |
分类号 |
H01L33/54;H01L23/50;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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