| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting machine of electronic components that can form a solder junction suitable for each of the electronic components, and to provide a manufacturing method for circuit boards. SOLUTION: A mask 10 having an opening 11 of a fixed thickness is brought into contact with a substrate 30, having a concave portion 32 and a pattern 31 on the top surface, and the opening 11 is filled with solder 50 by squeegee equipment 20, having many segmented squeegees 21, with their vertical and movement directions limited to form a solder junction 51. Electronic components are mounted on this junction. COPYRIGHT: (C)2009,JPO&INPIT
|
