| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multi-layer substrate of an assembly wherein a plurality of discrete ceramic packages are arranged, and cracks generated at the ends of its dividing grooves can be sensed. SOLUTION: In the ceramic multi-layer substrate 10 which comprises the assembly 12 with a plurality of ceramic packages 11 arranged, and having dividing grooves 13, 13a for dividing it into several pieces, a plurality of conductor-wiring testing patterns 18 which meander so as to intersect the dividing grooves 13, 13a, corresponding to the external shapes of all the ceramic packages 11, are provided on an intermediate-layer ceramic substrate 17 of the place, whereat no end of the dividing grooves 13, 13a arrives. Furthermore, in one dummy portion of the outer periphery of either of the principal surfaces of the assembly 12, a first conductor-wiring testing pad 19, which short-circuits all of the one-side terminals of the plurality of conductor-wiring testing patterns 18 as one common terminal, is provided; and moreover, in the other dummy portion of the outer periphery of either of the principal surfaces of the assembly 12, independent second conductor-wiring testing pads 20, which are connected with the other-side terminals of the plurality of conductor-wiring testing patterns 18, are provided. COPYRIGHT: (C)2009,JPO&INPIT
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