| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for polishing a peripheral portion of a substrate to be treated and a substrate treatment method, which performs accurate polishing, while suppressing the cost. SOLUTION: The substrate treatment apparatus 100 for polishing the peripheral portion of the substrate to be treated W comprises: a substrate holding means 2 for holding the substrate to be treated W; a polishing means 6, 7, 8 for polishing the peripheral portion of the substrate to be treated W held by the substrate holding means 2 by bringing an abrasive cloth into sliding contact with that peripheral portion; a holding tank 9 for holding the substrate to be treated W to be polished by the polishing means 6, 7, 8; and treatment solution supply means 11, 13 for supplying a treatment solution into the holding tank 9. During polishing work by the polishing means 6, 7, 8, the peripheral portion of the substrate to be treated W remains immersed in the treatment solution. COPYRIGHT: (C)2009,JPO&INPIT
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