| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin that can improve toughness in a cured product of an epoxy resin, that shows an excellent balance in various characteristics such as heat resistance, dielectric characteristics and moisture absorptivity and is useful for various composite materials such as an insulating material for electric and electronic parts (high reliability semiconductor sealing material and the like) and laminates (printed wiring boards, build-up boards and the like) and CFRP (carbon fiber reinforced plastics), adhesives and coating materials. SOLUTION: The epoxy resin is obtained by allowing a reaction product of a phenolic resin (a) having a repeating structure of a segment comprising two phenols coupled with an octahydrometanoindene structure as a linker with epihalohydrin to further react with a phenolic resin (b) having the same repeating structure as that of the phenolic resin (a). COPYRIGHT: (C)2009,JPO&INPIT
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