发明名称 |
SEMICONDUCTOR DEVICES WITH LAYERS HAVING EXTENDED PERIMETERS FOR IMPROVED COOLING AND METHODS FOR COOLING SEMICONDUCTOR DEVICES |
摘要 |
A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The device further includes a first metal layer bonded to the first surface of the transistor. The first metal layer has a first surface that defines a second area larger than the first area of the transistor. The device further includes a ceramic layer bonded to the first surface of the first metal layer.
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申请公布号 |
US2008303137(A1) |
申请公布日期 |
2008.12.11 |
申请号 |
US20070758833 |
申请日期 |
2007.06.06 |
申请人 |
WARD TERENCE G;YANKOSKI EDWARD P |
发明人 |
WARD TERENCE G.;YANKOSKI EDWARD P. |
分类号 |
H01L23/34;F25D17/02;H01L23/52 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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