| 摘要 |
A chemically-nonreactive, electrically-nonconductive shield having a recess generally corresponding to the shape of an airfoil portion to be positioned therein. The shield is submerged in an electroplating solution in a plating tank. The recess in the shield is sized to provide a predetermined, closely-spaced apart clearance gap between walls of the recess and the adjacent airfoil portion sufficient to reduce the flow rate of an electrolyte present in the electroplating solution between walls of the recess and the adjacent airfoil portion. The clearance gap permits control of the amount of electroplating that is deposited on the airfoil portion that is positioned within the recess in relation to portions of the airfoil not positioned within the recess.
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