| 摘要 |
Provided is a photosensitive resin composition having a sufficient process margin, capable of suppressing contamination of a kiln, a photo-mask, etc., due to sublimation of a photoinitiator component, and having adhesion, transparency and heat resistance required for a protective film material, and resolution and compression property required for a spacer material. The photosensitive resin composition contains [A] a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride and (a2) a copolymers of another ethylenically unsaturated compound, [B] a polymerizable compound having an ethylenically unsaturated bond, and [C] a photopolymerization initiator comprising a compound represented by formula (1).
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