| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component-built-in printed circuit board of a heat radiation structure which efficiently externally guide heat generated in a built-in circuit component. <P>SOLUTION: A component-built-in printed circuit board 10 includes a first substrate 11, a second substrate 14 laminated on the first substrate 11, a first semiconductor integrated circuit component 12 mounted inside of the first substrate 11, a second semiconductor integrated circuit component 15 mounted inside of the second substrate 14, and joint members 16 for joining the first and second semiconductor integrated circuit components 12 and 15 with a conductive joining material. <P>COPYRIGHT: (C)2009,JPO&INPIT |
