| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the number of components, to facilitate a manufacturing process, and to reduce parasitic inductance. <P>SOLUTION: A semiconductor device 1 includes a semiconductor chip 4 arranged between opposing radiator plates 2, 3, where the semiconductor chip 4, the radiator plates 2, 3 are molded with a resin 5. The semiconductor chip 4 is constituted of an IGBT chip incorporating FWD. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
