发明名称 BONDING APPARATUS AND BONDING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a compact and inexpensive bonding apparatus and bonding tool excellent in temperature control accuracy. SOLUTION: In the bonding tool 7 for press fixing a bonding object to a surface to be bonded while making loads and vibrations act on the bonding object, a heater 19 and a thermo-couple 20 are respectively mounted inside mounting holes 8g and 8h provided along the longitudinal direction of a horn 8, and a temperature when heating a bonding action part 10 by the heater 19 is measured by the thermo-couple 20. Thus, compared with the conventional system of measuring the surface temperature of the horn without contacting, the temperature of the bonding action part 10 is measured with high accuracy, and the compact and inexpensive bonding tool excellent in the temperature control accuracy is achieved. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300891(A) 申请公布日期 2008.12.11
申请号 JP20080237403 申请日期 2008.09.17
申请人 PANASONIC CORP 发明人 HISAKU MASAFUMI;TAKAHASHI SEIJI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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