| 摘要 |
A structure for preventing pad peeling includes a semiconductor substrate, a dielectric layer, a pad, and a protective layer. The semiconductor substrate has an active circuit structure. The dielectric layer is disposed on the semiconductor substrate and has an opening located in the dielectric layer above an edge position of the corresponding active circuit structure. Besides, the opening exposes a part of the surface of the active circuit structure. The pad disposed above the semiconductor substrate covers the dielectric layer above the position of the corresponding active circuit structure and fills up the opening. The protective layer is disposed on the dielectric layer and covers the edge of the pad.
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