| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that, in a semiconductor device which is a composite device wherein a plurality of individual semiconductor elements (chips) are incorporated in one package, it is difficult to reduce a size because it requires a lead frame to mount the individual semiconductor chips on and a resin layer and, in a flip-chip mounting semiconductor device, a reduction in size is possible because it requires no lead frame nor resin layer, but the composite device (semiconductor device) is difficult to be integrated. <P>SOLUTION: In one and the same substrate, a separation region which penetrates the substrate from one to the other principal plane is formed. The individual semiconductor elements are formed in a first individual semiconductor element region and a second individual semiconductor element region which are separated by the separation region. Thus, a flip-chip mounting composite device wherein a plurality of individual semiconductor elements are integrated on one chip can be materialized, resulting in reduction in size of the semiconductor device (composite device). <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
