| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent dew condensation from occurring at a cover section for covering a semiconductor element, and to reduce noise generation at a signal processing section of the semiconductor element. <P>SOLUTION: In a solid-state imaging apparatus 1, a hollow section 9 is formed between the solid-state imaging element 2 and the cover section 4, and an airway 7 leading to the outside from the hollow section 9 is formed at a bonding section 5. In this case, an interruption section 11 for interrupting the airway 7 is formed at a portion exposed from the cover section 4 in the airway 7. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
