| 摘要 |
PROBLEM TO BE SOLVED: To suppress temperature rise of a power supply unit. SOLUTION: The power supply unit 10 is provided with a heat dissipation body 11, a power supply module 12 bonded to the heat dissipation body 11, and a circuit board 13 disposed with a predetermined distance from the heat dissipation body surface 11 where the power supply module 12 is attached. The power supply module 12 is provided with a heat transfer plate 14 bonded to the heat dissipation body 11, and power semiconductor element 18A, 18B and an inductor component 19 which are mounted on the heat transfer plate 14. The inductor component 19 has a core portion 21 and a coil portion 22 for generating a magnetic filed around the core portion 21. The heat transfer plate 14 is inserted between the coil portion 22 and the core portion 21, a ventilation portion 25A penetrating the heat dissipation body 11 is formed below a transformer 19, and a ventilation portion 25B is formed on the circuit board 13. With this configuration, the temperature rise of the power supply unit 10 can be suppressed. COPYRIGHT: (C)2009,JPO&INPIT
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