发明名称 Plasma-driven cooling heat sink
摘要 A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the electrodes coupled with dielectric pieces and heat sink fins induce the gas flow, which is used to cool down heat sources. A magnetic circuit may be coupled with plasma-drive gas flow to enhance the cooling.
申请公布号 US2008302510(A1) 申请公布日期 2008.12.11
申请号 US20080157232 申请日期 2008.06.08
申请人 OUYANG CHIEN 发明人 OUYANG CHIEN
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
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