CUTTING METHOD AND WIRE SAW DEVICE

摘要

A method for cutting an ingot into a wafer by entraining a wire about a roller with a plurality of groove and, while supplying cutting slurry to the grooved roller, pressing the reciprocating wire against the ingot. A wire saw device cuts the ingot while controlling the temperature of the ingot by supplying ingot temperature regulation slurry while controlling the supply temperature independently from the cutting slurry wherein the ingot temperature regulation slurry is supplied to the ingot only to the delivery side of the reciprocating wire. When the ingot is cut by using a wire saw, sudden cooling of the ingot is reduced especially when the cutting of ingot approaches the end. Consequently, deterioration of nanotopography is suppressed and a method and a wire saw for cutting the ingot into a high quality wafer of uniform thickness are provided.