METHOD OF PROCESSING DOUBLE-SIDED CORE FOR PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a double-sided core substrate for multilayered printed circuit board is provided to prevent bending of the substrate by not requiring a half etching process or a film tent process. A first copper foil(20,30) is prepared in an upper surface and a lower surface interposing an insulating layer(10). The second copper foil is selectively exposed by forming a pattern through an image process of one surface of an inner layer core substrate on the second copper foil while interposing a metal adhesive on the first copper foil. The insulating layer is selectively opened and exposed by selectively etching the first copper foil and the second copper foil according to the pattern. A hole is made by irradiating the laser on the insulating layer which is opened and exposed. The first copper foil is exposed by peeling off and removing the metal adhesive coated between the first and second copper foils.