| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which has high reliability of a joint portion. SOLUTION: The power module is constituted by stacking an underlay conductive member 28 formed by a melt-spraying process (cold spraying process), a solder layer 14, and a semiconductor chip 11 in order on a metal wiring 23 made of a first material (Cu). The underlay conductive member 28 is formed by spraying a group of particles of a first material and a group of particles of a second material (Si, AL<SB>2</SB>O<SB>3</SB>, SiC, Si<SB>3</SB>N<SB>4</SB>, SiO<SB>2</SB>, AlN, W, Mo, invar alloy, etc.) having a thermal expansion coefficient smaller than that of the first material. The underlay conductive member 28 which has a thermal expansion coefficient smaller than that of the metal wiring 23 is interposed between the metal wiring 23 and solder layer 14, so that thermal stress due to the difference in thermal expansion coefficient between the upper and lower members which is applied to the solder layer 14 is reduced to suppress cracking of the solder layer 14. COPYRIGHT: (C)2009,JPO&INPIT |
