发明名称 COMPRESSION-MOLDING METHOD FOR ELECTRONIC COMPONENT AND METAL MOLD
摘要 PROBLEM TO BE SOLVED: To efficiently prevent foreign substances formed in the clearance (sliding part) between a cavity bottom surface member and a (partitioned) cavity side member and the occurrence of the defective slide of the cavity bottom surface member in a metal mold for compression-molding an electronic component. SOLUTION: In this compression-molding method, first, by partitioning the cavity side member individually into four sides of the cavity bottom surface member 10, the four partitioned cavity side members 11 are formed, metal molds 1 and 2 are clamped, and the electronic component 3 attached to a substrate 4 is immersed in a resin material (7) in a lower mold cavity 6. Next, by a first inside press mechanism 21 set in the partitioned cavity side member 11, while the partitioned cavity side member 11 is pressed to the cavity bottom surface member 10 by a required press force, in the lower mold cavity 6, the electronic component 3 is compression-molded in a resin molding 15 corresponding to the shape of the lower mold cavity 6. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008296382(A) 申请公布日期 2008.12.11
申请号 JP20070141640 申请日期 2007.05.29
申请人 TOWA CORP 发明人 TAKASE SHINJI;TAMURA KOJI;KO TAKEAKI
分类号 B29C43/34;B29C43/18;B29C43/36;B29K105/20;H01L21/56 主分类号 B29C43/34
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