| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding plate being capable of surely holding chip type electronic parts, as well as, having a large number of the chip type electronic components held per unit area. SOLUTION: When the chip type electronic component 4 is inserted and held to one holding hole 3a of a pair of mutually adjacent holding holes 3 (3a and 3b), (a) the relation of the size and shape of the chip-type electronic component 4 and the size and shape of a pair of the holding holes 3 (3a and 3b) and (b) the disposal mode of a pair of the holding holes 3 (3a and 3b) are set so that an elastic material 2 in the peripheries of the holding holes 3 is deformed and the chip-type electronic component 4 inserted into the other holding hole 3b is held by a force larger than the chip-type electronic component is not inserted into one holding hole 3a. The mutually adjacent holding holes 3 (3a and 3b) are disposed in the mode such that an end face 13a in the major-axial direction of one holding hole 3a of a pair of the mutually adjacent holding holes 3 (3a and 3b) faces a side face 13b, in the major-axial direction of the other holding hole 3b. COPYRIGHT: (C)2009,JPO&INPIT
|
