发明名称 |
METHOD OF DETERMINING ETCHING AMOUNT OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of determining an etching amount of a semiconductor device which can correctly define the etching amount by a simple procedure without spending a long time. SOLUTION: The method of determining the etching amount comprises steps of: forming a false electrode having a monitor having a plurality of step-like zones on a substrate; subsequently etching a primary zone and a secondary zone of the monitor simultaneously with an electrode of a test piece; defining the etching amount based on an exposed area of the substrate which appears at this time (first order determination); subsequently etching the secondary zone of the monitor simultaneously with the electrode; and defining the etching amount based on the exposed area of the substrate which appears at this time (final determination). COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008300592(A) |
申请公布日期 |
2008.12.11 |
申请号 |
JP20070144555 |
申请日期 |
2007.05.31 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
MIYOSHI MASAAKI |
分类号 |
H01L21/3065;H01L21/3205;H01L21/3213;H01L23/52 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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