| 摘要 |
PROBLEM TO BE SOLVED: To fix a plurality of silicon crystals with required thermal resistance and strength without using a mechanical means made of silicon. SOLUTION: As shown in A, a recess 1a is provided in a rod-shaped silicon crystal 1 and a projection 2a is provided on a rod-shaped silicon crystal 2. A recess 2b is provided at the tip of the projection 2a. After a bonding material 3 is put into the recess 2b as shown in B, the rod-shaped silicon crystals 1 and 2 are fitted together as shown in C. In this state, both crystals are put into an electric furnace, and the temperature and the atmosphere suitable for the bonding material 3 are achieved. When predetermined conditions are achieved, the bonding material 3 is melted to infiltrate into a clearance 4 between the surfaces to be bonded as shown in D. The rod-shaped silicon crystals 1 and 2 are firmly bonded together by cooling them. COPYRIGHT: (C)2009,JPO&INPIT
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