| 发明名称 |
VENTED DIE AND PACKAGE |
| 摘要 |
A die that includes a substrate having a first and second major surface is disclosed. The die has at least one unfilled through via passing through the major surfaces of the substrate. The unfilled through via serves as a vent to release pressure generated during assembly.
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| 申请公布号 |
US2008303031(A1) |
申请公布日期 |
2008.12.11 |
| 申请号 |
US20080133377 |
申请日期 |
2008.06.05 |
| 申请人 |
UNITED TEST AND ASSEMBLY CENTER LTD. |
发明人 |
TOH CHIN HOCK;LIU HAO;KOLAN RAVI KANTH |
| 分类号 |
H01L29/04;H01L21/00;H01L21/28 |
主分类号 |
H01L29/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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